Conductive Hot Glue
Conductive hot glue
Conductive Hot Glue (also called conductive hot melt adhesive) is a specialized thermoplastic adhesive engineered to deliver dual functionality: strong mechanical bonding and reliable electrical conductivity. Unlike traditional hot glue (which is inherently insulating due to its polymer base) , it incorporates conductive fillers-such as silver powder, copper particles, or carbon nanotubes-into its formulation to create electrical pathways between bonded substrates . When heated (150–180℃) and applied via a hot glue gun or automated dispensing system, it melts to adhere to materials, then cures as it cools to form a permanent bond with consistent conductivity. Ideal for applications where both adhesion and electrical connectivity are critical, it serves as a cost-effective, low-heat alternative to soldering-especially for heat-sensitive electronic components .
Conductive Hot GlueOur conductive hot glue is a one‑component epoxy conductive adhesive using conductive materials as the medium. It features high purity, excellent conductivity, low modulus, and long working life. The product also offers outstanding storage stability and performs reliably at the recommended temperature.
EVA-Based
Core formulation: EVA (ethylene-vinyl acetate) resin + carbon nanotube or nickel filler.
Features: Low melting point (120–150℃), cost-effective, and broad substrate compatibility (plastics, metals, fabrics).
Conductivity range: 1–10 Ω·cm; ideal for low-power applications like LED strip bonding and prototyping .
PA (Polyamide)
Base material: Polyamide resin + silver or copper filler for enhanced conductivity.
Advantages: High temperature resistance (up to 150℃), excellent mechanical strength, and oil resistance.
Use cases: Automotive sensors, wiring harnesses, and industrial electronic assemblies .
PES (Polyester)
Formulation: Polyester resin + conductive particles with flame-retardant additives.
Key specs: Heat resistance (130–180℃), chemical corrosion resistance, and low VOC emissions.
Suitable for high-reliability electronics like circuit boards and medical device components .
Epoxy-Modified
Specialized for demanding applications: Combines epoxy resin's rigidity with hot melt's fast curing.
Benefits: High conductivity (0.1–1 Ω·cm), superior bond strength, and resistance to harsh environments.
Used in aerospace electronics, high-power sensors, and automotive systems .
Low-Temperature
Melting point: 80–120℃; formulated with flexible polymers and silver-coated fillers.
Critical advantage: Safe for heat-sensitive components (e.g., LCD screens, plastic enclosures) and delicate prototypes .
Key Industry Applications
Conductive hot glue is indispensable across high-growth sectors where miniaturization, efficiency, and reliability are critical:
| Industry | Typical Use Cases | Recommended Product Type |
|---|---|---|
| Electronics & 3C | Circuit board (PCB) component bonding, LED strip assembly, flexible circuit connections, sensor wiring | PA/Epoxy-Modified Conductive Hot Glue |
| Automotive | Wiring harness fixation, sensor assembly, electric vehicle (EV) battery connections, interior electronics | PA-Based Conductive Hot Glue |
| Prototyping & DIY | Electronic project prototyping, Arduino/raspberry pi assemblies, hobbyist circuits | EVA/Low-Temperature Conductive Hot Glue |
| Medical Devices | Disposable medical sensor bonding, lightweight device electrical connections | PES/Low-Temperature Conductive Hot Glue |
| Aerospace | Avionics component assembly, lightweight wiring fixes | Epoxy-Modified Conductive Hot Glue |
| Renewable Energy | Solar panel wiring connections, small-scale battery pack assembly |
Advantages of Conductive hot glue
Stable electrical connection
It can be used for the electrical connection of electronic components, replacing the traditional welding process, which can provide a stable and reliable conductive path, reduce the problems of false welding and short circuit, and improve the quality and reliability of products.
01
Simple and efficient process
Easy to operate, just heat it to a certain temperature to make it melt, and then coated in the parts that need to be bonded and conductive, after cooling to achieve bonding and conductive function, no need for complex equipment and processes, can reduce production costs and production cycle.
02
Strong adaptability
According to different application requirements, the formula can be adjusted to change its conductive properties, bonding strength, curing time and other parameters to adapt to a variety of different materials and working environment.
03
Environmental protection and safety
No solvent volatilization, friendly to the environment, and in the process of use will not produce harmful gases and substances, in line with environmental requirements and safety standards.
04
Specifications
|
Product |
Appearance |
Vviscosity (@25℃,cps) |
Curingconditions |
Thermalconductivity |
Volumeresistivity |
Storage conditions |
Packing |
|
DB382 |
Silver Bronze |
20000-30000cps |
30Min@150℃ 60Min@120℃ |
7.1W(m.k) |
0.003Ω.cm |
6months@-20℃ |
10ml |
|
DB384 |
Dark Gray |
60000-80000cps |
30Min@120℃ |
/ |
40Ω.cm |
6months@-5℃ |
30ml |
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